Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. The ions strike the target and atoms are ejected (or sputtered) from the surface. These collisions cause an electrostatic repulsion which 'knock off' electrons from the sputtering gas atoms, causing ionization.
Why is sputtering more useful for alloy deposition?
Since the sputtering mechanism has a mechanical nature, refractory materials can be easily deposited at temperatures well below their melting point. In addition, it is very useful for the deposition of alloys and compounds, because the resulting film composition, generally, matches that of the source material.
Which materials can be easily deposited using DC sputtering method?
Magnetron sputtering using DC power is an effective and economical choice for depositing conductive materials such as metals or transparent conductive oxides (TCOs).
How is plasma created in sputtering?
A plasma is created by ionizing a sputtering gas (generally a chemically inert, heavy gas like Argon). The sputtering gas bombards the target and sputters off the material we'd like to deposit. Ions can be generated by the collision of neutral atoms with high energy electrons.
What is meant by sputtering process?
On an atomic level, sputtering is the process whereby atoms are ejected from a target or source material that is to be deposited on a substrate - such as a silicon wafer, solar panel or optical device - as a result of the bombardment of the target by high energy particles.
What are the different types of sputtering?
Several types of sputtering systems are used in practice including DC diode, RF-diode, magnetron diode, and ion beam sputtering.
What is sputtering in semiconductor?
Sputtering is a thin-filmthin-filmA thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness.https://en.wikipedia.org › wiki › Thin_filmThin film - Wikipedia manufacturing process widely used across many industries including semiconductor processing, precision optics, and surface finishing. A plasma is created by ionizing a sputtering gas, usually an inert gas such as argon or xenon.
How many types of sputter are there?
Several types of sputtering processes exist, including: ion beam, diode, and magnetron sputtering. Angstrom Sciences specializes in Magnetron Sputtering Technology. In a magnetron sputtering application, the high voltage is delivered across a low pressure gas (usually argon) in order to create high-energy plasma.
What is sputtering used for?
Sputtering is used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing. Thin antireflection coatings on glass for optical applications are also deposited by sputtering.
What are the steps involved in the sputtering process?
Basically the steps of sputtering process are the following: (i) the neutral gas is ionized by a external power supply, producing a glow dischargeglow dischargeA glow discharge is a plasma formed by the passage of electric current through a gas. It is often created by applying a voltage between two electrodes in a glass tube containing a low-pressure gas.https://en.wikipedia.org › wiki › Glow_dischargeGlow discharge - Wikipedia or plasma; (ii) a source (the cathode, also called the target) is bombarded in high vacuum by gas ions due to the potential drop acceleration in the cathode sheath; (iii)
What is the difference between DC and RF sputtering?
The main difference is that the power used in RF sputtering is AC, while that in DC sputtering is DC. Basically, during DC sputtering, the working gas will be ionized. During the positive electric field, the positive ions are accelerated to the surface of target and sputter it.
What is RF sputtering and magnetron sputtering?
RF Magnetron sputtering uses magnets behind the negative cathode to trap electrons over the negatively charged target material so they are not free to bombard the substrate, allowing for faster deposition rates. On the positive cycle electrons are attracted to the target material or cathode giving it a negative bias.
What is the RF frequency used for sputtering process?
13.56 MHz is the most used frequency for RF sputtering, although it can vary in the range from 5 to 30 MHz. However, RF system requires an impedance matching network between the power supply and the sputtering chamber.